Open Multimedia Application Platform for 3G Wireless Phones

Ms. Wanda Gass
Wireless Business Unit
Texas Instruments
Dallas, TX

gass@ti.com

Wednesday, October 4th, 7:00 PM, CPE 2.208


Abstract

Third generation wireless phones will offer higher bandwidth connectivity which will enable new services to be offered on next generation phones. Software will play a more important role in delivering the right set of features for 3G wireless terminals. An open software architecture is needed to enable a large number of software vendors to rapidly develop new applications that can be downloaded and customized for different users. Several companies have collaborated to define an open software architecture based on dual core platform that includes TI's low power DSP and ARM's low power MCU. A standard set of multimedia APIs ensures that software developed for the Open Multimedia Application Platform (OMAP) will run on all OMAP-compliant devices. OMAP offers a tightly integrated software development environment for both the DSP and MCU cores. OMAP also provides a configurable hardware platform that allows mobile phone vendors to customize their 3G solution and still meet aggressive development schedules.

Biography

Ms. Gass has been with Texas Instruments since 1980. She was involved in the circuit design and computer architecture for the first digital signal processor from TI, the TMS32010. In the mid 1990s, Dr. Gass worked on digital satellite set-top boxes, which included the design and implementation of MPEG video codecs on TI DSPs. Ms. Gass received a BSEE from Rice University and an MSEE from Duke University. Ms. Gass is a TI Fellow.


A list of Telecommunications and Signal Processing Seminars is available at from the ECE department Web pages under "Seminars". The Web address for the Telecommunications and Signal Processing Seminars is http://signal.ece.utexas.edu/seminars